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Процессор intel xeon x5570

Содержание

Количество ядер — 4, производится по 45 нм техпроцессу, архитектура Nehalem EP. Благодаря технологии Hyper-Threading, количество потоков 8, что вдвое больше числа физических ядер и увеличивает производительность многопоточных приложений и игр.

Базовая частота ядер Xeon X5570 — 2.93 ГГц. Максимальная частота в режиме Intel Turbo Boost достигает 3.333 ГГц. Обратите внимание, что кулер Intel Xeon X5570 должен охлаждать процессоры с TDP не менее 95 Вт на штатных частотах. При разгоне требования повышаются.

Материнская плата для Intel Xeon X5570 должна быть с сокетом FCLGA1366. Система питания должна выдерживать процессоры с тепловым пакетом не менее 95 Вт.

Цена в России

Семейство

Тест Intel Xeon X5570

Скорость в играх

Производительность Intel Xeon X5570 в играх и подобных приложениях, согласно нашим тестам.

Наибольшее влияние на результат оказывает производительность 4 ядер, если они есть, и производительность на 1 ядро, поскольку большинство игр полноценно используют не более 4 ядер.

Скорость в офисном использовании

Производительность в повседневной работе, например, браузерах и офисных программах.

Наибольшее влияние на результат оказывает производительность 1 ядра, поскольку большинство приложений использует лишь одно, игнорируя остальные.

Скорость в тяжёлых приложениях

Производительность в рендеринге, кодировании видео, работе с виртуальными машинами и базами данных.

Наибольшее влияние на результат оказывает производительность всех ядер и их количество, поскольку большинство профессиональных приложений охотно используют все ядра и соответственно увеличивают скорость работы.

Данные получены из тестов пользователей, которые тестировали свои системы как в разгоне, так и без. Таким образом, вы видите усреднённые значения, соответствующие процессору.

Скорость числовых операций

Мин. Среднее Макс.
67 1 ядро 78 93
120 2 ядра 152 180
Мин. Среднее Макс.
205 4 ядра 269 316
264 8 ядер 356 450

Для разных задач требуются разные сильные стороны CPU. Система с малым количеством быстрых ядер отлично подойдёт для игр, но уступит системе с большим количеством медленных ядер в сценарии рендеринга.

Мы считаем, что для бюджетного игрового компьютера подходит процессор с минимум 4 ядрами/4 потоками. При этом отдельные игры могут загружать его на 100% и тормозить, а выполнение любых задач в фоне приведёт к просадке ФПС.

В идеале покупатель должен стремиться к минимум 6/6 или 6/12, но учитывать, что системы с более чем 16 потоками сейчас применимы только в профессиональных задачах.

Данные получены из тестов пользователей, которые тестировали свои системы как в разгоне (максимальное значение в таблице), так и без (минимальное). Типичный результат указан посередине, в цветной полосе указана позиция среди всех протестированных систем.

Комплектующие

Материнские платы

  • Gigabyte GA-H97-HD3
  • Asus H110M-K
  • HP ProLiant ML310e Gen8 v2
  • Gigabyte GA-Z68X-UD3H-B3
  • HP Pavilion Desktop PC 570-p0XX
  • Acer Aspire TC-780
  • Apple MacBook4,1

Видеокарты

Оперативная память

  • Нет данных
  • Нет данных

Мы собрали список комплектующих, которые пользователи наиболее часто выбирают, собирая компьютер на базе Xeon X5570. Также с этими комплектующими достигаются наилучшие результаты в тестах и стабильная работа.

Самый популярный конфиг: материнская плата для Intel Xeon X5570 — Gigabyte GA-H97-HD3, видеокарта — GeForce 9800 GT.

Описание

Intel начала продажи Intel Xeon X5570 в марте 2009 по рекомендованной цене 49$. Это десктопный процессор на архитектуре Gainestown, в первую очередь рассчитанный на офисные системы. Он имеет 4 ядра и 8 потока и изготовлен по 45 нм техпроцессу, максимальная частота составляет 3.33 GHz, множитель заблокирован.

С точки зрения совместимости это процессор для сокета FCLGA1366 с TDP 95 Вт. Он поддерживает память DDR3-800, DDR3-1066, DDR3-1333.

Он обеспечивает слабую производительность в тестах на уровне 11.85% от лидера, которым является AMD EPYC 7742.

Specifications

Compare Intel® Products

Essentials

  • Product Collection Legacy IntelВ® XeonВ® Processors
  • Code Name Products formerly Nehalem EP
  • Vertical Segment Server
  • Processor Number X5570
  • Off Roadmap No
  • Status Discontinued
  • Launch Date Q1’09
  • Lithography 45 nm

Performance

  • # of Cores 4
  • # of Threads 8
  • Processor Base Frequency 2.93 GHz
  • Max Turbo Frequency 3.33 GHz
  • Cache 8 MB IntelВ® Smart Cache
  • Bus Speed 6.4 GT/s
  • # of QPI Links 2
  • TDP 95 W
  • VID Voltage Range 0.75V -1.35V

Supplemental Information

  • Embedded Options Available No
  • Datasheet View now

Memory Specifications

  • Max Memory Size (dependent on memory type) 144 GB
  • Memory Types DDR3 800/1066/1333
  • Max # of Memory Channels 3
  • Max Memory Bandwidth 32 GB/s
  • Physical Address Extensions 40-bit
  • ECC Memory Supported ‡ Yes

Package Specifications

  • Sockets Supported FCLGA1366
  • Max CPU Configuration 2
  • TCASE 75В°C
  • Package Size 42.5mm x 45mm
  • Processing Die Size 263 mm 2
  • # of Processing Die Transistors 731 million

Advanced Technologies

  • IntelВ® Turbo Boost Technology ‡ 1.0
  • IntelВ® Hyper-Threading Technology ‡ Yes
  • IntelВ® Virtualization Technology (VT-x) ‡ Yes
  • IntelВ® Virtualization Technology for Directed I/O (VT-d) ‡ Yes
  • IntelВ® VT-x with Extended Page Tables (EPT) ‡ Yes
  • IntelВ® 64 ‡ Yes
  • Instruction Set 64-bit
  • Idle States Yes
  • Enhanced Intel SpeedStepВ® Technology Yes
  • IntelВ® Demand Based Switching Yes

Security & Reliability

  • IntelВ® Trusted Execution Technology ‡ No
  • Execute Disable Bit ‡ Yes

Ordering and Compliance

Retired and discontinued

IntelВ® XeonВ® Processor X5570 (8M Cache, 2.93 GHz, 6.40 GT/s IntelВ® QPI) FC-LGA8, Tray

  • MM# 900835
  • Spec Code SLBF3
  • Ordering Code AT80602000765AA
  • Shipping Media TRAY
  • Stepping D0

Boxed IntelВ® XeonВ® Processor X5570 (8M Cache, 2.93 GHz, 6.40 GT/s IntelВ® QPI) FC-LGA8

  • MM# 901025
  • Spec Code SLBF3
  • Ordering Code BX80602X5570
  • Shipping Media BOX
  • Stepping D0

Trade compliance information

  • ECCN 3A991.A.1
  • CCATS NA
  • US HTS 8542310001

PCN/MDDS Information

SLBF3

  • 900835 PCN | MDDS
  • 901025 PCN | MDDS

Compatible Products

IntelВ® Server Board S5000HV Family

IntelВ® Server Board S5500HC Family

IntelВ® Server Board S5000UR Family

IntelВ® Server Board S5000WB Family

IntelВ® Server Board S5500BC Family

IntelВ® Server Board S5500HCT Family

IntelВ® Server Board S5500HCV Family

IntelВ® Workstation Board S5520SC Family

IntelВ® Compute Module MFS5000VI Family

IntelВ® Server System SR1600UR Family

IntelВ® Server System SR1625UR Family

IntelВ® Server System SR2600UR Family

IntelВ® Server System SR2625UR Family

IntelВ® Server System SC5000BC Family

IntelВ® Server System SC5000HC Family

IntelВ® Server System SR1000BC Family

IntelВ® Server System SR1000HV Family

IntelВ® Server System SR1000MV Family

IntelВ® Server System SR1000WB Family

IntelВ® Workstation System SC5000SC Family

Downloads and Software

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency

Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using IntelВ® Turbo Boost Technology and, if present, IntelВ® Thermal Velocity Boost. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. IntelВ® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

# of QPI Links

QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

V >VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

IntelВ® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandw >Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Turbo Boost Technology ‡

IntelВ® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology ‡

IntelВ® Hyper-Threading Technology (IntelВ® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x) ‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

IntelВ® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and ItaniumВ® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT) ‡

IntelВ® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in IntelВ® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64 ‡

IntelВ® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.В№ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

>Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStepВ® Technology

Enhanced Intel SpeedStepВ® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStepВ® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStepВ® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

IntelВ® Demand Based Switching

IntelВ® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStepВ® Technology in the server marketplace.

Intel® Trusted Execution Technology ‡

IntelВ® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to IntelВ® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit ‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn’t provide direct warranty support. Contact your OEM or reseller for warranty support.

Boxed Processor

Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.

More support options for IntelВ® XeonВ® Processor X5570 (8M Cache, 2.93 GHz, 6.40 GT/s IntelВ® QPI)

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Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with IntelВ® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Processors that support 64-bit computing on IntelВ® architecture require an Intel 64 architecture-enabled BIOS.

Мин. Среднее Макс.
284 Все ядра 362 455
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