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Intel начала продажи Intel Core 2 Duo E8400 в январе 2008. Это десктопный процессор на архитектуре Wolfdale, в первую очередь рассчитанный на офисные системы. Он имеет 2 ядра и 2 потока и изготовлен по 45 нм техпроцессу, максимальная частота составляет 3 GHz, множитель заблокирован.
С точки зрения совместимости это процессор для сокета Intel Socket 775 с TDP 65 Вт и максимальной температурой 72 °C. Он поддерживает память DDR1, DDR2, DDR3.
Он обеспечивает слабую производительность в тестах на уровне 4.54% от лидера, которым является AMD EPYC 7742.
✔OEM ✔3.0 ГГц ✔2-ядерный ✔Нет встроенной видеокарты ✔6144 КБ+ ✔65 Вт ✔1333 МГц ✔Socket LGA775 ✔Wolfdale
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Характеристики
| Предупреждения | |
| ПРЕДУПРЕЖДЕНИЕ2 | Встроенного видеоядра нет. Для возможности подключения монитора к серверу убедитесь в наличии встроенной в материнскую плату видеокарты либо доукомплектуйте игровой компьютер или рабочую станцию дискретной видеокартой. |
| Основные характеристики | |
| Производитель | Intel |
| Модель | Core 2 Duo Processor E8400 найти похожий процессор |
| Комплектация процессора | OEM |
| Назначение | Настольный ПК |
| Описание (продолжение) | Процессор для настольных компьютеров. |
| Корпус | FC-LGA6 |
| Частота шины CPU | 1333 МГц |
| Тип оборудования | Процессор для настольного ПК |
| Описание | наборы инструкций: SSE, SSE2, SSE3, SSE4.1, EVP (Enhanced Virus Protection/Execute Disable Bit), Intel Virtualization Technology (VT-x) |
| Рассеиваемая мощность | 65 Вт подходящий кулер |
| Критическая температура | 72.4°C |
| Напряжение питания | 0.85 |
1.3625 В
Опции, расходные материалы и аксессуары для Процессор Intel Core 2 Duo Processor E8400 OEM
Отзывы
Мы старались сделать описание как можно более хорошим, чтобы ваш выбор был безошибочным и осознанным, но т.к. мы, возможно, этот товар не эксплуатировали, а только со всех сторон пощупали, а вы его после того, как купите, испробуете в работе, ваш отзыв может сделать этот мир лучше, если ваш отзыв действительно будет полезным, то мы его опубликуем и дадим вам возможность следующую покупку у нас сделать по 2-й колонке.
Intel Core 2 Duo Processor E8400 — Качество и надёжность впечатляют.
Сравнение производительности и результаты тестов
Чтобы помочь вам сделать осознанный выбор, процессор был протестирован в Компьютерном Супермаркете НИКС 17-07-2017. Результаты тестирования наглядно отображены в диаграмме и двух таблицах.
На диаграмме приведены результаты тестов для выбранного артикула (выделен красным цветом) и еще 9 товаров, схожих по цене. Показатели в процентах указывают на приближение к макcимальному из зарегистрированных результатов. То есть, если ваш выбор пал на товар с показателем 50%, это означает, что есть аналог в 2 раза быстрее (с показателем 100%), но, разумеется, по совсем другой цене.
За диаграммой следует таблица с аналогичными показателями для 10 товаров-чемпионов в своей категории, в виде рейтинга ТОП10.
По этой таблице легко определить место процессора в общей "табели о рангах", а также оценить, насколько дорого будет попытаться повысить производительность. Выбранный товар также выделен красной строкой.
Последняя табличка — просто список результатов тестов. Из них подсчитывается процентный рейтинг, который использовался в двух первых отчетах. Кликнув на название теста, можно перейти к сводной таблице с показателями всех товаров категории, в том числе и отсутствующих на складе в данный момент.
Для сравнений используются только товары, которые сейчас есть в наличии.
Specifications
Compare Intel® Products
Essentials
- Product Collection Legacy IntelВ® Coreв„ў Processors
- Code Name Products formerly Wolfdale
- Vertical Segment Desktop
- Processor Number E8400
- Off Roadmap No
- Status Discontinued
- Launch Date Q1’08
- Lithography 45 nm
- Use Conditions PC/Client/Tablet
Performance
- # of Cores 2
- # of Threads 2
- Processor Base Frequency 3.00 GHz
- Cache 6 MB L2 Cache
- Bus Speed 1333 MHz
- FSB Parity No
- TDP 65 W
- VID Voltage Range 0.8500V-1.3625V
Supplemental Information
Package Specifications
- Sockets Supported LGA775
- TCASE 72.4В°C
- Package Size 37.5mm x 37.5mm
- Processing Die Size 107 mm 2
- # of Processing Die Transistors 410 million
Advanced Technologies
- Intel® Turbo Boost Technology ‡ No
- Intel® Hyper-Threading Technology ‡ No
- Intel® Virtualization Technology (VT-x) ‡ Yes
- Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes
- Intel® 64 ‡ Yes
- Instruction Set 64-bit
- Idle States Yes
- Enhanced Intel SpeedStepВ® Technology Yes
- IntelВ® Demand Based Switching No
- Thermal Monitoring Technologies Yes
Security & Reliability
- IntelВ® AES New Instructions No
- Intel® Trusted Execution Technology ‡ Yes
- Execute Disable Bit ‡ Yes
Ordering and Compliance
Retired and discontinued
IntelВ® Coreв„ў2 Duo Processor E8400 (6M Cache, 3.00 GHz, 1333 MHz FSB) LGA775, Tray
- MM# 893557
- Spec Code SLAPL
- Ordering Code EU80570PJ0806M
- Shipping Media TRAY
- Stepping C0
Boxed IntelВ® Coreв„ў2 Duo Processor E8400 (6M Cache, 3.00 GHz, 1333 MHz FSB) LGA775
- MM# 899035
- Spec Code SLB9J
- Ordering Code BX80570E8400
- Shipping Media BOX
- Stepping E0
Boxed IntelВ® Coreв„ў2 Duo Processor E8400 (6M Cache, 3.00 GHz, 1333 MHz FSB) LGA775
- MM# 895733
- Spec Code SLAPL
- Ordering Code BX80570E8400
- Shipping Media BOX
- Stepping C0
Boxed IntelВ® Coreв„ў2 Duo Processor E8400 (6M Cache, 3.00 GHz, 1333 MHz FSB) LGA775
- MM# 895696
- Ordering Code BX80570E8400
- Shipping Media BOX
- Stepping C0
IntelВ® Coreв„ў2 Duo Processor E8400 (6M Cache, 3.00 GHz, 1333 MHz FSB) LGA775, Tray
- MM# 898841
- Spec Code SLB9J
- Ordering Code AT80570PJ0806M
- Shipping Media TRAY
- Stepping E0
Boxed IntelВ® Coreв„ў2 Duo Processor E8400 (6M Cache, 3.00 GHz, 1333 MHz FSB) LGA775
- MM# 894369
- Spec Code SLAPL
- Ordering Code BX80570E8400A
- Shipping Media BOX
- Stepping C0
Trade compliance information
- ECCN 3A991.A.1
- CCATS NA
- US HTS 8542310001
PCN/MDDS Information
- 895696 MDDS
SLAPL
- 893557 PCN | MDDS
- 895733 PCN | MDDS
- 894369 MDDS
SLB9J
- 899035 PCN | MDDS
- 898841 PCN | MDDS
Compatible Products
Find Compatible Desktop Boards
Find boards compatible with the IntelВ® Coreв„ў2 Duo Processor E8400 in the Intel Desktop Compatibility Tool
IntelВ® Server Board S3200SH Family
IntelВ® Server Board X38ML Family
IntelВ® Server System SR1000SH Family
IntelВ® 4 Series Chipsets
IntelВ® 3 Series Chipsets
IntelВ® 3000 Series Chipsets
Downloads and Software
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
# of Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
# of Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Cache
CPU Cache is an area of fast memory located on the processor. IntelВ® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Bus Speed
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
FSB Parity
FSB parity provides error checking on data sent on the FSB (Front Side Bus).
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
V >VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
TCASE
Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).
Intel® Turbo Boost Technology ‡
IntelВ® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading Technology ‡
IntelВ® Hyper-Threading Technology (IntelВ® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
IntelВ® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and ItaniumВ® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® 64 ‡
IntelВ® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.В№ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
>Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStepВ® Technology
Enhanced Intel SpeedStepВ® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStepВ® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStepВ® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
IntelВ® Demand Based Switching
IntelВ® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStepВ® Technology in the server marketplace.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
IntelВ® AES New Instructions
IntelВ® AES New Instructions (IntelВ® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology ‡
IntelВ® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to IntelВ® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn’t provide direct warranty support. Contact your OEM or reseller for warranty support.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn’t provide direct warranty support. Contact your OEM or reseller for warranty support.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
More support options for IntelВ® Coreв„ў2 Duo Processor E8400 (6M Cache, 3.00 GHz, 1333 MHz FSB)
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with IntelВ® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
Processors that support 64-bit computing on IntelВ® architecture require an Intel 64 architecture-enabled BIOS.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.